See ENRIS 2019

Programme

Programme overview

  • Sunday 16th June

    13:00

    Registration

    14:00

    DISCUSSIONS ON INFRASTRUCTURE AND VALORISATION RELATED TOPICS

    Moderator: Pieter Telleman

    Participation NanoLab consortia

    Location: Waaier

    17:00

    TOURS

    NanoLab, High Tech Factory

    From 19:00

    EVENING PROGRAMME

    Location: U-Park

  • Monday 17th June

    08:00

    Registration

    09:00

    START PROGRAM WITH KEYNOTE SPEAKER

    Chair: Gerard Roelofs

     

    Keynote Speaker: Dennis Grimard

    Building MIT.nano … a philosophical journey to the nanoscale

    09:45

    PROCESSES

    09.45-10.10 | Thierry Chevolleau

    Etch process cleaning to improve wafer to wafer reproducibility

     

    10.10-10.35 | Nils Nordel

    A production Chemical Mechanical Planarization (CMP) tool in a research environment

     

    10.35-11.00 | Jesper Hanberg

    A flexible equipment proces datalog and sample tracking system

    10:45

    Break

    11:00

    STAFFING

    11.15-11.40 | Benjamin Reig

    New user’s training procedure in an open academic platform: LAAS-CNRS example


    11.40-12.05 | Anders Jorgensen

    Multistage microfabrication introduction package


    12.05-12.30 | Christiaan Bruinink

    SPC initiatives in the MESA+ NanoLab Cleanroom

    12:30

    Lunch

    13:30

    CONTINUE PROGRAM WITH KEYNOTE SPEAKER

    Chair: Frank Dirne


    Keynote Speaker: Erwin Kessels

    Atomic layer deposition: a true and enabling nanotechnology

    14:15

    EMERGING FABRICATION TECHNOLOGIES

    14.15-14.40 | Norbert Koster

    New EUV exposure system with XPS system


    14.40-15.05 | Manuel Lozano 

    Staff Organization in the IMB-CNM Cleanroom 


    15.05-15.30 | Henri Janssen

    Generic build-up of nanoscale silicon plasma etch processes’

    15:30

    Break

    15:45

    VALORIZATION

    15.45-16.10 | Hugues Granier

    Auditable billing of audited tariffs: a methodology for platform functioning funding


    16.10-16.35 | Yoshio Mita

    Japanese Nanotechnology Platform and a Trial Long-term Engineer Exchange between CNRSRENATECH and UTokyo Nanofab Site


    16.35-17.00 | David Barth

    NEMO: An open source, Collaboratively Developed Soft Management System


    17.00-17.25 | Graeme Maxwell

    Tyndall 2025 – Core equipment upgrade programme and transition to a Smart Manufacturing


    17.25-17.50 | Lorenza Ferrario

    The It-fab information system to address controlled process sharing among facilities

    18:00

    Closing

    18:30

    Transport to Conference Dinner

    From 20:00

    Conference dinner

  • Tuesday 18th June

    09:00

    START PORGRAM WITH KEYNOTE SPEAKER

    Chair: Jorg Hubner

    Keynote speaker: Guus Rijnders

    09:45

    INFRASTRUCTURE

    09.45-10.10 | Jorg Scholvin

    Understanding and Localizing Vibration Noise Sources


    10.10-10.35 | Frans Segerink

    Setting up a very low noise continuous vibration monitoring system and evaluating


    10.35-11.00 | Leif Johansen

    Risk management system for critical cleanroom supplies the measurements.

    11:00

    Break

    11:15

    TRL INFRASTRUCTURE

    Pieter Telleman, Jorg Hubner and Noah Clay

    12:30

    Lunch

    13:30

    CONTINU PROGRAM WITH KEYNOTE SPEAKER

    Chair: Noah Clay

    Keynote speaker: Gary Steele

    14:15

    COMPANY TALKS

    14.15-14.35 | Latticegear

    Cleaving is a science


    14.35-14.55 | Elis

    Connected Cleanroom


    14.55-15.15 | Kurt Lesker


    15.15-15.35 | PolyTeknik

    Towards research 4.0 – automated process development and characterisation

    16:15

    Closing

Keynote speakers

Erwin Kessels

Erwin Kessels is a full professor at the Department of Applied Physics of Eindhoven University of Technology (TU/e). He is also the scientific director of the NanoLab@TU/e facilities which provides full-service and open-access clean room infrastructure for R&D in nanotechnology.

Read more...

Gary Steele

Gary Steele is an Antoni van Leeuwenhoek Professor in the Quantum Nanoscience department at the Delft University of Technology. His research focusses on using quantum circuits for applications in mechanical quantum sensing, in probing materials, and for analogue quantum simulation.

Read more...

Dennis S. Grimard

Dennis S. Grimard received his Associates of Engineering (A.E.) degree in Mechanical Engineering Technology from Vermont Technical College in 1977 and his Bachelor of Science (B.S.) degree in electrical engineering from Worcester Polytechnic Institute in 1982. His postgraduate work includes both a Master of Science (M.S.) and Doctor of Philosophy (Ph.D.) degrees in electrical engineering (majoring in Solid-State Physics and minoring in Circuits) from The University of Michigan at Ann Arbor in 1984 and 1990, respectively. 

Read more...

prof.dr.ing. A.J.H.M. Rijnders (Guus)
Full Professor

Prof. Guus Rijnders is a professor at the University of Twente, the Netherlands. He obtained his PhD on October 31, 2001 on “Initial growth of complex oxides: study and manipulation”. In 2001 he became assistant professor at the Low Temperature Division, Applied Physics, University of Twente. In 2003 he switched to the Inorganic Materials Science group and since 2006 he was associate professor in this group. As of April 1st, 2010 he is full professor in nanoelectronic materials at the MESA+ Institute for Nanotechnology, University of Twente. As from 2015 he is Scientific director of the MESA+ Institute for Nanotechnology .

The research of Prof Guus Rijnders focuses on the structure‐property relation of atomically engineered complex (nano)materials, especially thin film oxides, mostly used for electronic and sensing devices. The class of investigated materials includes, amongst others, ferromagnetic, superconducting, ferroelectric as well as piezoelectric materials. In recent years, he started new research directions in the field of functional and smart materials, such as piezoelectric and ferroelectric materials, and their integration with electronic and micro electromechanical systems (MEMS), Si‐CMOS and III‐V technologies.

Read more...